Drying and baking for PCB and ABF substrate lines #
PCB and ABF substrate manufacturing involves repeated coating, lamination, exposure, development, and baking steps. WEISUN’s equipment is configured for panel handling, clean room operation, low oxygen, and automated transport.
The official application link for PCB/ABF Industry points to the AGV, RGV, MGV Clean Room & Inert Gas Oven (AQWOL). Its process coverage is listed as PCB D/F, lamination, plug hole, solder mask, SAP, bumping, and panel fan-out.
Relevant processes #
- PCB dry film and lamination
- Plug hole and solder mask baking
- SAP and bumping processes
- Panel fan-out and advanced substrate processing
- ABF dry-film preheat and lithography post-exposure bake
- Automated transport with AGV, RGV, or MGV
Representative equipment #
- AGV, RGV, MGV Clean Room & Inert Gas Oven — RT–300°C, ±1.5%, ISO Class 5, 1% O2, automated material handling.
- Top-Down Airflow Auto Oven — Dual-chamber automation, 450°C, 20 ppm O2, exhaust and solvent recovery, PCB ECI data upload.
- HWPH Preheater — FCBGA/FCCSP post-exposure bake; ABF dry-film preheat and lithography post-exposure bake.
- WCO Conveyor Drying Equipment — Inline hot-air drying for PCB, panel, ABF, and electronics production.