Clean and low-oxygen environments for sensitive processes #
The Clean Room & Inert Gas category contains two product families. The WOL uses HEPA filtration to control particles; the QWO uses nitrogen purging and positive pressure to control oxygen. Both are used where ordinary hot-air ovens would introduce contamination or oxidation.
WOL Clean Room Oven #
The WOL is a clean room oven with a special rear-door panel that is designed to remain deformation-free under heating, reducing heat loss and supporting temperature uniformity. An imported HEPA filter provides 99.97% filtration efficiency, and the chamber is described as achieving ISO 14644-1 Class 4–6 @ 0.3 µm cleanliness.
Models WOL-2, WOL-3, WOL-7, and WOL-8 cover chamber sizes from 70 × 50 × 60 cm to 150 × 70 × 160 cm, with temperature ranges up to 300°C depending on the model. Applications include LCD, furnace tubes, wafer fabrication, light guide plates, IC, transistors, diodes, LED, backlight modules, and fixture curing.
QWO Inert Gas Oven #
The QWO is an inert gas oven that uses nitrogen to displace oxygen and maintain a low-oxygen atmosphere. Its official description states that it can reduce oxygen to as low as 10 ppm and save about 30% of nitrogen consumption.
Key design features include an adjustable pressure-relief valve for positive pressure, a hermetic seal at the tubular heater cable outlet, a main/auxiliary N2 throttling design, a cooling interlayer that maintains an oxygen-free environment during cooling, and an inner door that forms a nitrogen barrier. Applications include IC packaging, wafer baking, film deposition, semiconductor drying, PCB baking, panel drying, and ABF substrate drying.