Thermal processes for energy-related manufacturing #
The official WEISUN application link for Energy Industry points to the HWO High-Temperature Forced Convection Oven. The HWO is a 500°C-class oven (600°C optional) used for high-temperature baking, film deposition, and metal heat treatment.
Energy manufacturing also benefits from WEISUN’s pressure and vacuum equipment where encapsulation, potting, or bubble removal is required. The Vacuum/Pressure Cure Oven, for example, is described for EV/IGBT/SiC power-module potting and sealing.
Relevant processes #
- High-temperature baking and film deposition
- Glass coating, age hardening, and annealing
- MLCC, thermistor, and electronic filter processing
- Power-module potting, sealing, and void elimination
- Vacuum drying and defoaming
Representative equipment #
- HWO High-Temperature Forced Convection Oven — Ambient to 500°C, 600°C optional; reinforced chamber; up to 20% energy savings.
- Vacuum/Pressure Cure Oven — Vacuum degassing plus high-pressure void elimination for power-module potting and sealing.
- HTWV Ultra High-Temperature Steam Reactor — Up to 600°C for high-temperature thermal processes with waste-heat recovery.
- WVO Vacuum Oven — Vacuum drying and defoaming for resins and volatile liquids.