Clean, low-oxygen thermal processing for semiconductors #
Semiconductor processes require control of particles, oxygen, temperature uniformity, and data traceability. WEISUN’s semiconductor line ranges from full-automatic clean room and inert gas ovens to FOPLP-specific ovens and vacuum/pressure cure ovens.
The official application link for SEMI Industry points to the Full-Automatic High-Temperature Clean Room & Inert Gas Oven (AQHWOL). It supports EFEM or robotic-arm loading, built-in sensors, networked PLC controllers, and data upload to the factory server.
Relevant processes #
- Wafer-level packaging and fan-out panel-level packaging
- PR/PI curing and baking
- Advanced substrate and glass/steel carrier processing
- Low-oxygen and clean room thermal processes
- Underfill, die attach, and void elimination
- Wafer vacuum curing
Representative equipment #
- Full-Automatic High-Temperature Clean Room & Inert Gas Oven — RT–450°C, ±1.5%, ISO Class 5, 20 ppm O2, EFEM/robot integration.
- Smart Oven with Clean and Oxidation-Free — FOPLP-oriented, 200°C, ±1.5%, Class 100, <50 ppm O2, 700 × 700 mm carrier capability.
- AGV, RGV, MGV Clean Room & Inert Gas Oven — RT–300°C, 1% O2, automated material handling, CPS and electronic batch records.
- Vacuum/Pressure Cure Oven — Vacuum degassing and high-pressure void elimination for DAF, underfill, and advanced packaging.
- Top-Down Airflow Auto Oven — Dual-chamber automation, 450°C, ISO Class 5, 20 ppm O2, exhaust and solvent recovery.