Automated clean room and inert gas ovens for smart factories #
WEISUN’s Industry 4.0 line combines clean, low-oxygen thermal processing with automated material handling and data integration. The ovens can be paired with AGV, RGV, MGV, EFEM, robotic arms, loaders, and unloaders, and can upload temperature, oxygen, and equipment status data to factory systems.
The official category page lists four products. The descriptions below are excerpts; open the official product page for full specifications, options, and drawings.
Smart Oven with Clean and Oxidation-Free (AQWOL-5S) #
A clean room and inert gas oven tailored to fan-out panel-level packaging (FOPLP). It provides ±1.5% temperature uniformity, Class 10–100 clean room compatibility, and in-chamber oxygen concentration below 50 ppm. A 28-zone automatic damper system adjusts the recipe according to batch size, reducing manual setup and improving repeatability.
The chamber is designed for 700 × 700 mm steel carriers and glass panels from 310 × 310 mm up to 700 × 700 mm. Loading can be manual or automated with AMR + robot or conveyor + robot. Communication options include CIM, Ethernet, SECS/GEM, and PCB ECI.
Top-Down Airflow Auto Oven (ANWOL) #
A dual-chamber automated oven and winner of the 32nd Taiwan Excellence Award. It uses a patented multi-layer air door for 99% airtightness, a water-cooling system with an average cooling rate of 4.5°C per minute, and exhaust and solvent recovery that reclaims 25% of organic solvents.
The oven supports AGV/RGV/MGV and robotic arms, PCB ECI data upload, smoke detection, remote configuration, and an early-warning system for parts. Process temperature reaches RT–450°C, temperature uniformity is ±1.5%, cleanliness is ISO 14644-1 Class 5, and oxygen concentration is 20 ppm.
Full-Automatic High-Temperature Clean Room & Inert Gas Oven (AQHWOL) #
A fully automated oven that can be paired with EFEM or robotic arms. It uses built-in sensors for temperature, O2/N2 concentration, AGV battery capacity, material position, and door status, plus networked PLC controllers for the oven, loader, and airflow motors.
Specifications include RT–450°C, ±1.5% temperature uniformity, ISO 14644-1 Class 5 cleanliness, 20 ppm oxygen concentration, and CIM, Ethernet, SECS/GEM, and PCB ECI communication. It is intended for chip and substrate curing in PR/PI processes, wafer-level packaging, and fan-out panel-level packaging.
AGV, RGV, MGV Automated Guided Vehicle Clean Room & Inert Gas Oven (AQWOL) #
A fully automated clean room and inert gas oven compatible with AGV, RGV, and electric or manual trolleys (MGV). It integrates sensors and controllers through IoT, uses a CPS cyber-physical system for capacity and efficiency, and creates electronic batch records for quality traceability.
The oven operates at RT–300°C with ±1.5% temperature uniformity, ISO 14644-1 Class 5 cleanliness, and 1% oxygen content. Its process coverage includes PCB D/F, lamination, plug hole, solder mask, SAP, bumping, and panel fan-out. Carrying capacity is customizable.