Preheating for ABF and advanced substrate processes #
The Preheat Drying Equipment category currently lists the HWPH Preheater, a conveyor-type preheat oven developed for panel and substrate processes.
HWPH Preheater #
The HWPH is designed for FCBGA and FCCSP post-exposure bake (PEB), ABF carrier board dry-film lamination preheat, and lithography post-exposure bake. Its unique axle design is intended to prevent material jamming and thermal deformation, while the low-wear gear assembly reduces dust generation.
The air damper can be adjusted to the product requirement and combined with a recirculation system for heat reuse. The chamber uses high-temperature HEPA filtration, full argon welding to keep external dust out, and high-density Japanese rock wool insulation. An efficient motor reduces energy use during long operation.
Official specifications include:
- Model: HWPH-1000U-A02
- External dimension: W950 × D1530 × H2380 mm
- Cleanliness: ISO 14644-1 Class 5 @ 0.3 µm
- Temperature range: RT + 10°C to 90°C maximum
- Temperature uniformity: ±2°C (board temperature measurement)
- Applicable panel size: 508 × 508 mm, thickness 0.1–3 mm
- Conveyor direction: right to left (facing the HMI)
- Conveyor speed: 0.8–3 ± 0.1 m/min
- Temperature controller: Japanese-made PID + SSR with HMI and relay PC