Vacuum and pressure curing for void-free packaging #
The Pressure Drying Equipment category covers ovens that combine vacuum and positive pressure. The purpose is to remove air from encapsulation materials and bonding interfaces before curing, then compress remaining micro-bubbles so that the resin fills the cavity.
Vacuum/Pressure Cure Oven #
The Vacuum/Pressure Cure Oven (VPCO) integrates vacuum degassing with high-pressure void elimination. Large voids are evacuated during the vacuum stage; high pressure then dissolves persistent micro-bubbles into the resin. The result is higher package density and lower risk of delamination.
The official specification lists:
- Maximum temperature: 250°C
- Temperature uniformity: 200°C ± 3°C (no load)
- Cleanliness: Class 100, verified by particle counter
- Pressure control accuracy: within ±0.1 kg/cm²
- Maximum pressure: 10 kgf/cm²
- Vacuum level: 5 Torr with a dry pump
- Oxygen concentration: 20 ppm
- Workpiece: 12-inch wafers × 26 pcs; glass substrates 310 × 310 mm in a 380 × 380 mm cassette × 26 pcs
Applications include die attach film (DAF) bonding and capillary underfill (CUF) in advanced semiconductor packaging; potting and sealing of EV/IGBT/SiC power modules; and OCA lamination, touch glass bonding, polarizer attachment, and optical bonding for displays.