Oxidation control and high-temperature processing for advanced materials #
Advanced materials often combine temperature-sensitive interfaces with oxidation-sensitive metals, resins, or coatings. WEISUN addresses these processes with inert gas ovens, high-temperature ovens, vacuum ovens, and sintering furnaces.
The official WEISUN application link for Advanced Materials points to the QWO Inert Gas Oven. The QWO uses nitrogen purging and positive pressure to reduce oxygen to as low as 10 ppm and is described as saving about 30% of nitrogen consumption.
Relevant processes #
- Oxidation-free baking and curing
- IC packaging and wafer baking
- Film deposition and coating processes
- High-temperature annealing and age hardening
- Vacuum drying and defoaming
- Sintering and ashing tests
Representative equipment #
- QWO Inert Gas Oven — 10 ppm oxygen control, low nitrogen consumption, positive-pressure design, and cooling interlayer for oxidation-sensitive processes.
- HTWV Ultra High-Temperature Steam Reactor — Ambient to 500°C, 600°C optional; high thermal penetration and waste-heat recovery.
- WVO Vacuum Oven — Vacuum level to 5 × 10⁻³ Torr or higher for drying, defoaming, and bubble removal.
- WSF High-Temperature Sintering Furnace — RT to 1200°C with quadruple insulation and dual-sided radiant heating.